1/5 stps30l30ct/cg/cr september 2000 - ed: 4c low drop power schottky rectifier ? dual center tap schottky rectifiers suited for switch mode power supply and high frequency dc to dc converters. packaged in to-220ab, d 2 pak and i2pak, these devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. description n very small conduction losses n negligible switching losses n extremely fast switching n low forward voltage drop n low thermal resistance features and benefits symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f(rms) rms forward current 30 a i f(av) average forward current tc = 140c d = 0.5 per diode per device 15 30 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 220 a i rrm peak repetitive reverse current tp = 2 m s f = 1khz square 1a i rsm non repetitive peak reverse current tp = 100 m s square 3a t stg storage temperature range - 65 to + 150 c tj maximum operating junction temperature * 150 c dv/dt critical rate of rise reverse voltage 10000 v/ m s absolute ratings (limiting values, per diode) a1 k a2 i f(av) 2x15a v rrm 30 v tj (max) 150 c v f (max) 0.37 v main product characteristics d 2 pak stps30l30cg a1 k a2 to-220ab stps30l30ct *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink a2 k a1 a1 k a2 i 2 pak STPS30L30CR
stps30l30ct/cg/cr 2/5 symbol parameter tests conditions min. typ. max. unit i r * reverse leakage cur- rent tj = 25c v r =v rrm 1.5 ma tj = 125c 170 350 ma v f * forward voltage drop tj = 25c i f =15a 0.46 v tj = 125c i f =15a 0.33 0.37 tj = 25c i f =30a 0.57 tj = 125c i f =30a 0.43 0.5 pulse test : * tp = 380 m s, d <2% to evaluate the conduction losses use the following equation : p = 0.24x i f(av) + 0.009 i f 2 (rms) static electrical characteristics (per diode) symbol parameter value unit r th (j-c) junction to case per diode total 1.5 0.8 c/w r th (c) coupling 0.1 c/w thermal resistance when the diodes 1 and 2 are used simultaneously : d tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) 0 2 4 6 8 101214161820 0 1 2 3 4 5 6 7 8 9 10 if(av) (a) pf(av)(w) t d =tp/t tp d = 1 d = 0.5 d = 0.2 d = 0.1 d = 0.05 fig. 1: average forward power dissipation versus average forward current (per diode). 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 if(av)(a) rth(j-a)=15c/w rth(j-a)=rth(j-c) rth(j-a)=50c/w t d =tp/t tp tamb(c) fig. 2: average current versus ambient temperature ( d =0.5) (per diode).
stps30l30ct/cg/cr 3/5 1e-3 1e-2 1e-1 1e+0 0 25 50 75 100 125 150 175 200 225 250 im(a) tc=25c tc=110c tc=75c t(s) i m t d =0.5 fig. 3: non repetitive surge peak forward current versus overload duration (maximum values) (per diode). 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) t d =tp/t tp single pulse d = 0.5 d = 0.2 d = 0.1 fig. 4: relative variation of thermal transient impedance junction to case versus pulse duration. 0 5 10 15 20 25 30 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 vr(v) ir(ma) tj=125c tj=25c tj=150c fig. 5: reverse leakage current versus reverse voltage applied (typical values) (per diode). 12 51020 50 0.1 1.0 5.0 vr(v) c(nf) f=1mhz tj=25c fig. 6: junction capacitance versus reverse voltage applied (typical values) (per diode). 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 10 100 200 vfm(v) ifm(a) tj=150c (typical values) tj=125c tj=25c fig. 7: forward voltage drop versus forward current (maximum values - per diode). 0 4 8 12 16 20 24 28 32 36 40 0 10 20 30 40 50 60 70 80 s(cu) (cm2) rth(j-a) (c/w) fig. 8: thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, e(cu) = 35 m m) (stps30l30cg).
stps30l30ct/cg/cr 4/5 package mechanical data to-220ab a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 package mechanical data i 2 pak ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e 10.0 10.4 0.394 0.409 l 13.1 13.6 0.516 0.535 l1 3.48 3.78 0.137 0.149 l2 1.27 1.40 0.050 0.055 e d l l1 l2 b1 b b2 e a c2 a1 c n cooling method: c n recommended torque value: 0.55 m.n n maximum torque value: 0.70 m.n
stps30l30ct/cg/cr 5/5 package mechanical data d 2 pak a c2 d r a2 m v2 c a1 g l l3 l2 b b2 e * * flat zone no less than 2mm ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 8.90 3.70 1.30 5.08 16.90 10.30 foot print (in millimeters) information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2000 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com ordering type marking package weight base qty delivery mode stps30l30ct stps30l30ct to-220ab 2g 50 tube stps30l30cg stps30l30cg d 2 pak 1.8g 50 tube stps30l30cg-tr stps30l30cg d 2 pak 1.8g 1000 tape & reel STPS30L30CR STPS30L30CR i 2 pak 1.49g 50 tube n epoxy meets ul94,v0
|
